IPC-2581 Consortium Opens its Doors to New Members
Getting OEMs, design tool providers, EMS providers and others to agree on a standard for transferring data files has proven a difficult challenge. The IPC-2581 Consortium, formed to help industry...
View ArticleLead Usage Continues to Grow
Companies in the electronics industry have spent billions in recent years to remove lead from solder, ensuring that the few ounces of this toxic metal on a printed board don’t leach into water...
View ArticlePrinted Electronics Gains Momentum
The printed electronics industry continues to expand rapidly. Nearly every week, companies are announcing positive steps that demonstrate solid growth. Thin Film Electronics ASA rolled out a...
View ArticleSimpler Sharing of Design Files is on the Horizon
Myriad acronyms segment the world of design tools: CAD, CAM, CAE and PLM to name a few. Whether the tools are computer-aided design/manufacturing/engineering or product lifecycle management, there’s a...
View ArticleFord, Siemens Make Google Earth an Industrial Tool
One of the interesting trends of this decade is the drive to use consumer technologies everywhere, from cars and airplanes to manufacturing sites. The huge investments fuel many rapid advancements that...
View ArticleAn Improved Technique for Translating Drawings
Globalization requires paying attention to many details, some of them unexpected. As IPC began increasing the number of standards that are translated and converting documents into more languages, they...
View ArticleNew Microvia Definition Seeing Broader Usage
In 2013, IPC changed its definition of a microvia. Before then, a microvia was defined as any printed board with holes that have a diameter of equal to or less than 0.15 mm [0.006 in]. Over time, that...
View ArticleSpotting Trends in EMS Markets
The pace of business has increased as Web connections and mobile phones increase the sense of immediacy. That’s prompted a lot of interest in lists of bullet points that sum up some of the salient...
View ArticleHighlighting the Fun Side of Technology
The best keynote speeches at trade shows often come from speakers who highlight the fun in technology and engineering. They acknowledge that there’s a lot of grunt work involved in most technical...
View ArticleCopper Pillar Packaging Development Poses Challenges, but Technology Helps...
Designers of electronic products are always pushing to reduce size and weight while adding more functionality. That often puts them at the forefront of the evolution of high density chips and printed...
View ArticleWatching Tin Whiskers Grow for Nearly a Decade
Tin whiskers remain a vexing issue for many applications, particularly those in aerospace where a decade is often a fraction of a product’s lifetime. One of the key challenges is finding protective...
View ArticleVolunteering: Just the Cure for Disassociated Workers
In the United States, approximately one in four people volunteers in one fashion or another. Anyone involved with IPC might be surprised by that statistic from the U.S. Bureau of Labor Statistics. The...
View ArticleJoint Team Trims Standard Development Cycle
Getting multiple groups to work together often extends the time it takes to finish a project. But when IPC and JEDEC teamed up to create a standard for grid array package testing, they shortened the...
View ArticleSatisfying the Hunger for Knowledge
When people decide which trade show they want to attend, they often face a choice that’s a bit like picking a restaurant. They can go to a buffet-like conference where there are many different...
View ArticleNvidia Jumps on Package-on-Package Bandwagon
Package-on-package got another endorsement last week when Nvidia said it would use 3-D packaging on some forthcoming Pascal graphics processors to make more memory available with minimal delays. The...
View ArticleNanotechnology Researchers Replace Solder with Water
Advanced research is often really interesting, and often not-so-much. For me, that’s especially true with nanotechnology. Some projects have potential to change things. Others seem like pipe dreams...
View ArticleGodspeed, Dieter Bergman
I first met Dieter Bergman in the early 1980s, in a small IPC office in Evanston. It had tons of boxes of booklets jammed in between huge copiers and desks so old they could have been updated by...
View ArticleTrade Show Pact Strengthens IPC’s Position in Greater China
IPC has bolstered its footprint in Asia, extending an alliance with the Hong Kong Printed Circuit Association (HKPCA). After successfully teaming up to run the International Printed Circuit & APEX...
View ArticleTeresa Rowe Aims to Help Committee Chairs Grow
Teresa Rowe has seen a lot of value in IPC’s programs over the past couple decades. They helped her advance in her career, and she’s helped write documents that provide the foundations for continued...
View ArticleIPC Working Group Focuses on Nuances of Conformal Coating
As products get smaller and denser, factors that used to be fairly easy to deal with can become areas of concern. Conformal coatings are getting increased interest now as usage grows and the quality of...
View Article